Panel on Commerce and Industry
Meeting on 17 July 2018
Submissions from deputations/individuals
(position as at 17 July 2018)
Submissions from deputations/individuals attending the meeting
| Name of deputation/individual | Submission | Date of issue | |
|---|---|---|---|
| 1. | Hong Kong Electronics & Technologies Association | LC Paper No. CB(1)1238/17-18(10) (English version only) | 10 July 2018 |
| 2. | Asia Pacific Youth Club | LC Paper No. CB(1)1238/17-18(11) (Chinese version only) | 10 July 2018 |
| 3. | GS1 Hong Kong | LC Paper No. CB(1)1271/17-18(01) (English version only) | 13 July 2018 |
| 4. | Hong Kong Computer Society | LC Paper No. CB(1)1275/17-18(01) (English version only) | 16 July 2018 |
| 5. | Asia Pacific Youth Development Foundation Limited | LC Paper No. CB(1)1278/17-18(01) (English version only) | 17 July 2018 |
| 6. | Mr Paul FUNG | LC Paper No. CB(1)1278/17-18(02) (Chinese version only) | 17 July 2018 |
Submissions from deputations/individuals not attending the meeting
| Name of deputation/individual | Submission | Date of issue | |
|---|---|---|---|
| 1. | The Hong Kong Institution of Engineers | LC Paper No. CB(1)1238/17-18(12) (English version only) | 10 July 2018 |
| 2. | The Chinese Manufacturers' Association of Hong Kong | LC Paper No. CB(1)1238/17-18(13) (Chinese version only) | 10 July 2018 |
| 3. | Federation of Hong Kong Industries | LC Paper No. CB(1)1278/17-18(03) (Chinese version only) | 17 July 2018 |